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 User's Manual
QB-V850EIA4
In-Circuit Emulator
Target Devices V850ES/IK1 V850E/IA3 V850E/IA4
Document No. U17167EJ4V0UM00 (4th edition) Date Published September 2007 NS
(c)
Printed in Japan
[MEMO]
2
User's Manual U17167EJ4V0UM
IECUBE is a registered trademark of NEC Electronics Corporation in Japan and Germany. MULTI, Green Hills Software, TimeMachine, and SuperTrace are trademarks of Green Hills Software, Inc.
* The information in this document is current as of September, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1
User's Manual U17167EJ4V0UM
3
General Precautions for Handling This Product
1. Circumstances not covered by product guarantee * If the product was disassembled, altered, or repaired by the customer * If it was dropped, broken, or given another strong shock * Use at overvoltage, use outside guaranteed temperature range, storing outside guaranteed temperature range * If power was turned on while connection to the AC adapter, USB interface cable, or target system was in an unsatisfactory state * If the cable of the AC adapter, the USB interface cable, the emulation probe, or the like was bent or pulled excessively * If an AC adapter other than the supplied product was used * If the product got wet * If this product is connected to the target system when there is a potential difference between the GND of this product and GND of the target system. * If the connectors or cables are plugged/unplugged while this product is in the power-on state. * If excessive load is applied to the connectors or sockets. 2. Safety precautions * If used for a long time, the product may become hot (50C to 60C). Be careful of low temperature burns and other dangers due to the product becoming hot. * Be careful of electrical shock. There is a danger of electrical shock if the product is used as described above in 1 Circumstances not covered by product guarantee. * The AC adapter supplied with the product is exclusively for this product, so do not use it with other products.
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User's Manual U17167EJ4V0UM
INTRODUCTION
Readers
This manual is intended for users who wish to perform debugging using the QBV850EIA4. The readers of this manual are assumed to be familiar with the device functions and usage, and to have knowledge of debuggers.
Purpose
This manual is intended to give users an understanding of the basic specifications and correct usage of the QB-V850EIA4.
Organization
This manual is divided into the following sections. * General * Setup procedure * Settings at product shipment * Notes * Optional functions
How to Read This Manual
It is assumed that the readers of this manual have general knowledge in the fields of electrical engineering, logic circuits, and microcontrollers. This manual describes the basic setup procedures and how to set switches. To understand the overall functions and usages of the QB-V850EIA4 Read this manual according to the CONTENTS. The mark "" shows major revised points. The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. To know the manipulations, command functions, and other software-related settings of the QB-V850EIA4 See the user's manual of the debugger (supplied with the QB-V850EIA4) to be used.
Conventions
Note: Caution: Remark: Numeric representation:
Footnote for item marked with Note in the text Information requiring particular attention Supplementary information Binary ... xxxx or xxxxB Decimal ... xxxx Hexadecimal ... xxxxH
Prefix indicating power of 2 (address space, memory capacity): K (kilo): 210 = 1,024 M (mega): 220 = 1,0242
User's Manual U17167EJ4V0UM
5
Terminology
The meanings of the terms used in this manual are described in the table below.
Term Target device Target system
TM
Meaning This is the device to be emulated. This is the system to be debugged (system provided by the user). This includes the target program and the hardware provided by the user.
IECUBE
Generic name for NEC Electronics' high-performance/compact in-circuit emulator.
Related Documents
Please use the following documents in combination with this manual. The related documents listed below may include preliminary versions. However, preliminary versions are not marked as such.
Documents Related to Development Tools (User's Manuals)
Document Name QB-V850EIA4 (in-circuit emulator) CA850 Ver. 3.00 C Compiler Package Operation C Language Assembly Language Link Directives ID850QB Ver. 3.40 Integrated Debugger SM+ System Simulator Operation Operation User Open Interface RX850 Ver. 3.20 Real-Time OS Basics Installation Technical Task Debugger RX850 Pro Ver. 3.20 Real-Time OS Basics Installation Technical Task Debugger AZ850 Ver. 3.30 System Performance Analyzer PM+ Ver. 6.00 Project Manager
Document Number This manual U17293E U17291E U17292E U17294E U18604E U18010E U17663E U13430E U17419E U13431E U17420E U13773E U17421E U13772E U17422E U17423E U17178E
Caution
The related documents listed above are subject to change without notice. Be sure to use the latest version of each document for designing, etc.
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User's Manual U17167EJ4V0UM
CONTENTS
CHAPTER 1 GENERAL .............................................................................................................................9
1.1 1.2 1.3 1.4 Hardware Specifications................................................................................................................................10 System Specifications ...................................................................................................................................11 System Configuration ....................................................................................................................................12 Package Contents ..........................................................................................................................................15
CHAPTER 2 SETUP PROCEDURE.........................................................................................................17
2.1 2.2 2.3 Names and Functions of Hardware ..............................................................................................................18 Removal of Acrylic Board..............................................................................................................................20 Clock Settings ................................................................................................................................................20 2.3.1 2.3.2 2.3.3 2.3.4 2.4 2.5 Overview of clock settings..................................................................................................................20 Clock setting methods ........................................................................................................................21 Notes on changing resonators............................................................................................................22 Notes on using oscillator ....................................................................................................................23
Setting for Target Device ...............................................................................................................................24 Software Settings ...........................................................................................................................................24 2.5.1 2.5.2 When using ID850QB as debugger....................................................................................................24 When using other than ID850QB (MULTITM, etc.) as debugger ..........................................................24 Mounting target connector (TC) to target system ...............................................................................25 Plugging exchange adapter (EA) into TC ...........................................................................................25 Notes on handling TC, EA, MA, CA, or SA.........................................................................................26 Mounting TC in target system ............................................................................................................26 Connecting YQ on TC ........................................................................................................................27 Inserting EA into YQ...........................................................................................................................27 Precautions for handling TC, YQ, and SA ..........................................................................................28 Precautions for mounting IC using TC and MA ..................................................................................28 When not using extension probe (QB-144-EP-01S/02S)....................................................................29 When using extension probe (QB-144-EP-01S/02S) .........................................................................30
2.6
Mounting and Connecting Connectors (When Using S Type) ...................................................................25 2.6.1 2.6.2 2.6.3

2.7
Mounting and Connecting Connectors (When Using T Type)....................................................................26 2.7.1 2.7.2 2.7.3 2.7.4 2.7.5
2.8
Connecting QB-V850EIA4 to Target System................................................................................................29 2.8.1 2.8.2
2.9
Connecting USB Interface Cable and AC Adapter ......................................................................................34
2.10 Switching Power On and Off .........................................................................................................................34
CHAPTER 3 SETTINGS AT PRODUCT SHIPMENT ............................................................................35 CHAPTER 4 NOTES.................................................................................................................................36
4.1 Cautions Regarding Differences Between Actual Device And Emulator ..................................................36 4.1.1 4.1.2 4.1.3 4.1.4 4.1.5 Operation after power application to target system ............................................................................36 Oscillator ............................................................................................................................................36 Pin characteristics ..............................................................................................................................36 Notes on flash self programming function ..........................................................................................36 Notes on DBTRAP instruction ............................................................................................................36
User's Manual U17167EJ4V0UM
7
4.1.6 4.1.7 4.1.8 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6 4.2.7 4.2.8 4.2.9 4.2.10
CLKOUT pin in standby mode ............................................................................................................36 On-chip debug function.......................................................................................................................36 Current consumption ..........................................................................................................................36 Notes on Non-map Break ...................................................................................................................37 PSC Register Access .........................................................................................................................37 Notes on DBPC, DBPSW, and ECR Registers...................................................................................37 Notes on Trace Display Sequence .....................................................................................................37 Notes on Starting Debugger ...............................................................................................................37 Simultaneously Executing Two Instructions When Hardware Break Is Set ........................................38 Operation during Break.......................................................................................................................40 When an Illegal Break Occurs during Program Execution in Internal RAM ........................................41 Motor control pins ...............................................................................................................................41 Conflict between program execution for internal RAM and DMA transfer...........................................41
Notes On Debugging......................................................................................................................................37
CHAPTER 5 OPTIONAL FUNCTIONS .................................................................................................. 42
5.1 Coverage Measurement Function .................................................................................................................43 5.1.1 5.1.2 5.2 5.3 5.4 Functional outline ...............................................................................................................................43 Differences from hardware specifications ...........................................................................................43
TimeMachine Function...................................................................................................................................44 Changes to Top Side of Product Consequent to Addition of Optional Functions ...................................44 How to Add Optional Functions ....................................................................................................................45
APPENDIX A REVISION HISTORY ....................................................................................................... 46
A.1 Major Revisions in This Edition ....................................................................................................................46 A.2 Revision History of Preceding Editions .......................................................................................................46
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User's Manual U17167EJ4V0UM
CHAPTER 1 GENERAL
The QB-V850EIA4 is an in-circuit emulator for emulating the target device shown below. Hardware and software can be debugged efficiently in the development of systems in which the target device is used. This manual descries basic setup procedures, hardware specifications, system specifications, and how to set switches. Target device : V850ES/IK1, V850E/IA3, V850E/IA4
User's Manual U17167EJ4V0UM
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CHAPTER 1 GENERAL
1.1
Hardware Specifications
Table 1-1. QB-V850EIA4 Hardware Specifications
Parameter Specification V850ES/IK1 VDD = EVDD = 4.5 to 5.5 V AVDD = 4.5 to 5.5 V VSS = EVSS = AVSS = 0 V V850E/IA3, V850E/IA4 VDD = CVDD = 2.3 to 2.7 V EVDD = AVDD = 4.5 to 5.5 V VSS = EVSS = CVSS = AVSS = 0 V
Target system interface voltage
Maximum operating frequency
When emulating V850E/IA3 or V850E/IA4: 64 MHz When emulating V850ES/IK1: 32 MHz
Operating temperature range Storage temperature range External dimensions Power consumption Weight Host interface AC adapter Target system power supply
0 to 40C (No condensation) -15 to +60C (No condensation) See figure below 15 V, 1 A Same level or lower than target device 412 g USB interface (1.1, 2.0)
113 mm
Note 1
109 mm
Note 2
68 mm
Note 3
Rear spacer Front spacer
Note 4
Notes 1 Does not include projection of power switch 2 Includes projection of screw that fixes rear spacer 3 Dimension when rear spacer is made shortest (108 mm when longest) 4 Front spacer can vary from 20 mm (longest) to 5 mm (shortest)
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User's Manual U17167EJ4V0UM
CHAPTER 1 GENERAL
1.2
System Specifications
This section shows the QB-V850EIA4 system specifications. For the usage of the debugging function, refer to ID850QB Ver. 3.40 Operation User's Manual (U18604E). Table 1-2. QB-V850EIA4 System Specifications
Parameter Emulation memory capacity Internal ROM Internal RAM External memory Program execution functions Break functions Real-time execution function Non-real-time execution function Hardware break 1 MB max. 60 KB max. 16 MB max. (optional) (mapping possible in 1 MB units) Go, Start from Here, Go & Go, Come Here, Restart, Return Out Step In, Next Over, Slowmotion Execution: 10 points Access: 6 points Software break Fail-safe break Other Trace functions Trace data types 2000 points Non-map, I/O illegal, write protect Trace full break, forced break, timer overflow break Branch-source PC, branch-destination PC, all PCs, all execution data, access data, access address, R/W status, time stamp, DMA point (start/end) Trace modes Trace events Memory capacity Real-time RAM monitoring function Time measurement functions Measurement clock Measurement objects Real-time trace, Complete trace Delay trigger, section, qualify 256K frames 256 bytes x 8 points 50 MHz Beginning through end of program execution Start event through end event (7 sections) Maximum measurement time Approximately 195 hours (When using measurement-dedicated clock divided by 32) Minimum resolution Number of timers for measurement Measurement results 20 ns 8 Execution time (Start through end of execution) Maximum, minimum, average, pass count (between events) Other Coverage function Measured range Other functions Timer overflow break function (1 point) Detection of execution or pass (optional) Internal ROM space + arbitrary 1 MB space Mapping function, event function, register manipulation function, memory manipulation function Specification
Caution
Depending on the debugger, some functions are not supported.
User's Manual U17167EJ4V0UM
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CHAPTER 1 GENERAL
1.3
System Configuration
This section shows the system configuration when using the QB-V850EIA4 connected to a host machine (a computer equipped with a USB port). Connection is possible even without optional products. Connectors <8> to <12> differ depending on the target device to be emulated. Figure 1-1. System Configuration (S Type)
<3> <4> <1>
<5> <6>
<2>
<7> <8>
: Products enclosed by broken lines are optional. <9> <11> <10>
<12> <13>
<1> Host machine: <2> ID850QB Disk/Accessory DiskNote 1: <3> USB interface cable: <4> AC adapter: <5> QB-V850EIA4: <6> Extension probe (coaxial type) (option) <7> Extension probe (flexible type) (option) <8> Exchange adapter: <9> Check pin adapter (option): <10> Space adapter (option): <11> Mount adapter (option): <12> Target connector: <13> Target system
Computer equipped with a USB port Debugger, USB drivers, manual, etc. Cable connecting QB-V850EIA4 to host machine Can support 100 to 240 V by replacing AC plug This product
Adapter that performs pin conversion Adapter used when observing waveforms on oscilloscopeNotes 2, 3 Adapter for height regulationNote 2 Adapter for socket mounting target device Connector soldered to target system
Notes 1. Obtain device files from the NEC Electronics website. http://www.necel.com/micro/index_e.html 2. If both <9> and <10> are used, connection sequence of <9> and <10> may be reversed. 3. <6> is always required if <9> is used.
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User's Manual U17167EJ4V0UM
CHAPTER 1 GENERAL
Remark
For notes on target system design and package drawings, refer to [Related Information] on the following URL. http://www.necel.com/micro/index_e.html Figure 1-2. System Configuration (T Type) <5> <1> <4> <3> <2>

<6>
<7> <8>
: Products enclosed by broken lines are
<9> <10 > <12> <11>
<13>
<14>
<1> Host machine: <2> ID850QB Disk/Accessory Disk <3> USB interface cable: <4> AC adapter: <5> QB-V850EIA4: <6> Check pin adapter (optional): <7> Extension probe flexible type (optional) <8> Extension probe coaxial type (optional) <9> Exchange adapter: <10> Space adapter (optional): <11> Mount adapter (optional): <12> YQ connector: <13> Target connector: <14> Target system Note Remark
Note
Computer equipped with a USB port : Debugger, USB drivers, manual, etc. Cable used for connecting QB-V850EIA4 to host machine Can support 100 to 240 V by replacing AC plug This product Adapter used for monitoring waveforms with oscilloscope
Adapter that performs pin conversion Adapter used for height adjustment Adapter used for mounting target device Connector used for connecting emulator Connector to be soldered to target system
Download the device file from the NEC Electronics website. http://www.necel.com/micro/index_e.html For notes on target system design and package drawings, refer to [Related Information] on the following URL. http://www.necel.com/micro/index_e.html
User's Manual U17167EJ4V0UM
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CHAPTER 1 GENERAL
Table 1-3. List of Probe/Connector for Each Target Device (S Type)
Target Device to Be Emulated No. Name V850ES/IK1 (64-Pin GC) <6> Extension probe (coaxial type) QB-144-EP-01S (sold separately) <7> Extension probe (flexible type) QB-144-EP-02S (sold separately) <8> Exchange adapter QB-64GC-EA-01S (sold separately) <9> Check pin adapter QB-64-CA-01S (sold separately) <10> Space adapter QB-64-SA-01S (sold separately) <11> Mount adapter QB-64GC-MA-01S (sold separately) <12> Target adapter QB-64GC-TC-01S (sold separately)
Note Note
V850E/IA3 (80-Pin GC)
V850E/IA4 (100-Pin GC)
V850E/IA4 (100-Pin GF)
QB-80GC-EA-01S (sold separately) QB-80-CA-01S (sold separately) QB-80-SA-01S (sold separately) QB-80GC-MA-01S (sold separately) QB-80GC-TC-01S (sold separately)
Note Note
QB-100GJ-EA-02S (sold separately) QB-100-CA-01S (sold separately) QB-100-SA-01S (sold separately) QB-100GC-MA-01S (sold separately) QB-100GC-TC-01S (sold separately)
Note Note
QB-100GF-EA-02S (sold separately)
Note
QB-100GF-MA-02S (sold separately) QB-100GF-TC-01S (sold separately)
Note

Table 1-4. List of Probe/Connector for Each Target Device (T Type)
Target Device to Be Emulated No. Name V850ES/IK1 (64-Pin GC) <6> Check pin adapter QB-144-CA-01 (sold separately) <7> Extension probe (flexible type) QB-144-EP-02S (sold separately) <8> Extension probe (coaxial type) QB-144-EP-01S (sold separately) <9> Exchange adapter QB-64GC-EA-02T (sold separately) <10> Space adapter
Note
V850E/IA3 (80-Pin GC)
V850E/IA4 (100-Pin GC)
V850E/IA4 (100-Pin GF)
QB-80GC-EA-03T (sold separately)
Note
QB-100GC-EA-02T (sold separately)
Note
QB-100GF-EA-02T (sold separately)
Note
QB-64GC-YS-01T (sold separately)
QB-80GC-YS-01T (sold separately) QB-80GC-HQ-01T (sold separately) QB-80GC-YQ-01T (sold separately)
Note
QB-100GC-YS-01T (sold separately) QB-100GC-HQ-01T (sold separately) QB-100GC-YQ-01T (sold separately)
Note
QB-100GF-YS-01T (sold separately) QB-100GF-HQ-02T (sold separately) QB-100GF-YQ-01T (sold separately)
Note
<11>
Mount adapter
QB-64GC-HQ-01T (sold separately)
<12>
YQ connector
QB-64GC-YQ-01T (sold separately)
Note
<13>
Target connector
QB-64GC-NQ-01T (sold separately)
Note
QB-80GC-NQ-01T (sold separately)
Note
QB-100GC-NQ-01T (sold separately)
Note
QB-100GF-NQ-01T (sold separately)
Note
Note These accessories are supplied depending on the part number ordered (Refer to 1.4 Package Contents).
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User's Manual U17167EJ4V0UM
CHAPTER 1 GENERAL
1.4
Package Contents
The following items have been placed in the QB-V850EIA4 packing box. Please check the contents. Products supplied with QB-V850EIA4-ZZZ 1: 2: 3: 4: 5: 6: 7: 8: 9: 10: QB-V850EIA4 AC adapter USB interface cable ID850QB Disk (CD-ROM) Accessory Disk (CD-ROM) IECUBE Setup Manual User registration (Guarantee card and software contract in one) Simple flash memory programmer (PG-FPL or QB-MINI2) Probe holder Parts board (for clock)
Products supplied with QB-V850EIA4-S100GC 1 to 10 11: 12: Exchange adapter QB-100GC-EA-02S Target connector QB-100GC-TC-01S
Products supplied with QB-V850EIA4-S100GF 1 to 10 11: 12: Exchange adapter QB-100GF-EA-02S Target connector QB-100GF-TC-01S
Products supplied with QB-V850EIA4-S80GC 1 to 10 11: 12: Exchange adapter QB-80GC-EA-01S Target connector QB-80GC-TC-01S
Products supplied with QB-V850EIA4-S64GC 1 to 10 11: 12: Exchange adapter QB-64GC-EA-01S Target connector QB-64GC-TC-01S
Products supplied with QB-V850EIA4-T100GC 1 to 10 11: 12: 13: Exchange adapter QB-100GC-EA-02T YQ connector QB-100GC-YQ-01T Target connector QB-100GC-NQ-01T

Products supplied with QB-V850EIA4-T100GF 1 to 10 11: 12: 13: Exchange adapter QB-100GF-EA-02T YQ connector QB-100GF-YQ-01T Target connector QB-100GF-NQ-01T
User's Manual U17167EJ4V0UM
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CHAPTER 1 GENERAL

Products supplied with QB-V850EIA3-T80GC 1 to 10 11: 12: 13: Exchange adapter QB-80GC-EA-03T YQ connector QB-80GC-YQ-01T Target connector QB-80GC-NQ-01T

Products supplied with QB-V850ESIK1-T64GC 1 to 10 11: 12: 13: Exchange adapter QB-64GC-EA-02T YQ connector QB-64GC-YQ-01T Target connector QB-64GC-NQ-01T
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User's Manual U17167EJ4V0UM
CHAPTER 2 SETUP PROCEDURE
This chapter explains the QB-V850EIA4 setup procedure. Setup can be completed by performing installation/setup in the order in which it appears in this chapter. Perform setup along the lines of the following procedure. See 2.1 Names and Functions of Hardware for jumper and clock board positions.
Clock settings An 8 MHz resonator is mounted when shipped. The setting does not have to be changed if an 8 MHz resonator can be used. If modification is necessary, see 2.2 Removal of Acrylic Board and 2.3 Clock Settings.
Target device settings The QB-V850EIA4 is set for the V850E/IA3 or V850E/IA4 when shipped. For V850E/IA3 or V850E/IA4 emulation, no changes are required. To use for the V850ES/IK1, see 2.2 Removal of Acrylic Board and 2.4 Setting for Target Device
Software settings See 2.5 Software Settings.
Mounting and connecting connectors When using the S Type, see 2.6 Mounting and Connecting Connectors (When Using S Type). When using the T Type, see 2.7 Mounting and Connecting Connectors (When Using T Type).
Connecting QB-V850EIA4 to target system See 2.8 Connecting QB-V850EIA4 to Target System. * When not using the extension probe (QB-144-EP-01S/02S): see 2.8.1. * When using the extension probe (QB-144-EP-01S/02S): see 2.8.2.
Connecting USB interface cable and AC adapter See 2.9 Connecting USB Interface Cable and AC adapter.
Switching power on and off See 2.10 Switching Power On and Off
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CHAPTER 2 SETUP PROCEDURE
2.1
Names and Functions of Hardware
Figure 2-1. Names of Parts of QB-V850EIA4 Top View Power switch MAIN CLOCK Bottom View
JP1 JP2 JP3 JP4
POWER
TARGET
CN3 CN2 CN1
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User's Manual U17167EJ4V0UM
CHAPTER 2 SETUP PROCEDURE
(1) CN1, CN2, CN3 These connectors are used to connect the exchange adapter or extension probe. (2) MAIN CLOCK (for clock) This parts board is used to mount the resonator. An oscillator with an 8 MHz resonator and a capacitor are mounted at shipment. (For details, refer to 2.3 Clock Settings.) (3) JP1 This jumper is used to change the setting depending on the operating frequency. Pins 1 and 2 are shorted at shipment. (For details, refer to 2.3 Clock Settings). (4) JP2 This jumper is used for delivery inspection. All the pins of this jumper are open at shipment. Other settings are prohibited. (5) JP3 This jumper is used to change the setting depending on the type of the clock mounted on the MAIN CLOCK. Pins 1 and 2, and pins 3 and 4 are shorted, pins 5 and 6, and pins 7 and 8 are left open at shipment (refer to 2.3 Clock Settings for details). (6) JP4 This jumper is used to change the setting depending on the target device. Pins 2 and 3 are shorted at shipment (refer to 2.4 Setting of Target Device). (7) POWER (Red LED) This is an LED that shows whether or not the power supply of the QB-V850EIA4 is switched on.
LED State Lit Not lit Blinking Power switch ON Power switch OFF or AC adapter not connected to QB-V850EIA4 Internal error occurred (Contact an NEC Electronics sales representative or distributor) QB-V850EIA4 State
(8) TARGET (Green LED) This is an LED that shows whether or not the power supply of the target system is switched on.
LED State Lit Not lit Target system power supply ON Target system power supply OFF or target system not connected Target System State
(9) Power switch This is the power switch of the QB-V850EIA4. It is OFF at shipment.
User's Manual U17167EJ4V0UM
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CHAPTER 2 SETUP PROCEDURE
2.2
Removal of Acrylic Board
To modify the jumper or clock setting, the acrylic board on the bottom of the QB-V850EIA4 must be removed. The acrylic board can be removed by lifting it up. Figure 2-2. Acrylic Board Removal Method
2.3
2.3.1
Clock Settings
Overview of clock settings
The following 5 types of clock settings are available. For details, see 2.3.2 Clock setting methods. (1) Using the clock generated from an 8 MHz resonator mounted on the QB-V850EIA4 as an internal clock (setting at shipment). (2) Using the clock generated from a 6.876 to 8 MHz resonator on the QB-V850EIA4. (3) Using the clock generated from a 4.0 to 6.875 MHz resonator on the QB-V850EIA4. (4) Using the clock generated from a 6.876 to 8 MHz oscillator on the QB-V850EIA4. (5) Using the clock generated from a 4.0 to 6.875 MHz oscillator on the QB-V850EIA4. Cautions 1. In this product, clock input from the target system is not supported. 2. Clock when emulating the V850ES/IK1 During emulating the V850ES/IK1, half the clock mounted on the MAIN CLOCK is used as the clock in the QB-V850EIA4. Therefore, to the MAIN CLOCK, mount a resonator or oscillator whose frequency is twice that of the clock that is mounted to the target system. To use a 4 MHz clock as the main clock, for example, mount an 8 MHz clock (= two times as 4 MHz) on the MAIN CLOCK.
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User's Manual U17167EJ4V0UM
CHAPTER 2 SETUP PROCEDURE
2.3.2
Clock setting methods
This section shows the hardware settings when setting the clock. Table 2-1. Hardware Setting with Each Clock Setting
Type of Clock Used The clock generated from an 8 MHz resonator on QB-V850EIA4 is used as internal clock (Setting at shipment) MAIN CLOCK
8 9 10 11 12 13 14 7 6 5 4 3 2 1
JP1 Setting
V850E/IA3, V850E/IA4 PLLSIN Pin State
Note
JP3 Setting
3 2 1
1-2 shorted (Setting at shipment) High level
8 6 4 2
7-8: Open 5-6: Open
7 5 3 1
(Setting at shipment)
3-4: Shorted 1-2: Shorted (Setting at shipment) The clock generated from a 6.876 to 8 MHz resonator on QB-V850EIA4 is used as internal clock
8 9 10 11 12 13 14 7 6 5 4 3 2 1
3 2 1
1-2 shorted (Setting at shipment) High level
8 6 4 2
7-8: Open 5-6: Open
7 5 3 1
Supplied parts board is used
3-4: Shorted 1-2: Shorted (Setting at shipment)
The clock generated from a 4.0 to 6.875 MHz resonator on QB-V850EIA4 is used as internal clock
8 9 10 11 12 13 14
7 6 5 4 3 2 1
3 2 1
2-3 shorted Low level
8 6 4 2
7-8: Open 5-6: Open
7 5 3 1
Supplied parts board is used
3-4: Shorted 1-2: Shorted (Setting at shipment)
The clock generated from a 6.876 to 8 MHz oscillator on QB-V850EIA4 is used as internal clock 5 V 8-pin or 14-pin type oscillator is used
3 2 1
1-2 shorted (Setting at shipment) High level
8 6 4 2
7 5 3 1
7-8: Shorted 5-6: Shorted 3-4: Open 1-2: Open
The clock generated from a 4.0 to 6.875 MHz oscillator on QB-V850EIA4 is used as internal clock 5 V 8-pin or 14-pin type oscillator is used
3 2 1
2-3 shorted Low level
8 6 4 2
7 5 3 1
7-8: Shorted 5-6: Shorted 3-4: Open 1-2: Open
Note When using the V850ES/IK1, setting is not necessary. Caution Settings other than above are prohibited.
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2.3.3 top.
Notes on changing resonators
When changing the resonator that was mounted when shipped, pull the MAIN CLOCK parts board out once to the
* Solder a resonator and a capacitor to the parts board supplied with the QB-V850EIA4. The setting is as follows. Pins 1 and 14: Be sure to short-circuit. Pins 2 and 13: Connect a capacitor. Pins 3 and 12: Connect a resonator. Pins 4 and 11: Be sure to open. Pins 5 and 10: Connect a capacitor. Pins 6 and 9: Pins 7 and 8: Be sure to short-circuit. Be sure to open. Figure 2-3. Setting Parts Board
7
6
5
43
21
8
9 10 11 12 13 14
* Insert the parts board to the QB-V850EIA4 MAIN CLOCK. Figure 2-4. Inserting Parts Board
7 6 5 43 21
Insert Parts board
8
9 10 11 12 13 14
QB-V850EIA4 board
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2.3.4
Notes on using oscillator
To change the main clock to the clock generated from the oscillator, pull the parts board mounted on the MAIN CLOCK out. Mount the oscillator to be used to the MAIN CLOCK socket as shown below. Figure 2-5. Mounting MAIN CLOCK
14-pin type
8-pin type
(socket)
When mounting an 8-pin type crystal oscillator, make pin 1 of the oscillator and pin 1 of the MAIN CLOCK socket match and pin 8 of the oscillator and pin 14 of the MAIN CLOCK socket match.
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2.4
Setting for Target Device
The setting of JP4 differs depending on the target device. To emulate the V850ES/IK1: 1-2 shorted To emulate the V850E/IA3, V850E/IA4: 2-3 shorted (setting at shipment) Other settings are prohibited. Figure 2-6. Setting JP4 To use the V850ES/IK1 To use the V850E/IA3, V850E/IA4
3 2 1
JP4 Short 1 and 2.
3 2 1
JP4 Short 2 and 3 (setting at shipment).
2.5
2.5.1
Software Settings
When using ID850QB as debugger
For details, refer to the V850 Series Integrated Debugger ID850QB Operating Precautions supplied with the debugger (ID850QB). 2.5.2 When using other than ID850QB (MULTITM, etc.) as debugger
Refer to the user's manual of the debugger used and the V850 IECUBE Setup Manual (supplied).
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2.6
Mounting and Connecting Connectors (When Using S Type)
This section describes the methods of connecting the QB-V850EIA4 and target system. Make connections with both the QB-V850EIA4 and target system powered OFF. The following abbreviations are used in this section. * TC: Target connector * EA: Exchange adapter * MA: Mount adapter * CA: Check pin adapter * SA: Space adapter 2.6.1 Mounting target connector (TC) to target system
(1) Apply cream solder to the foot pattern of the target system for mounting an IC. (2) A circular projection is at the center of the bottom side of TC (refer to Figure 2-7). Sparingly apply two-liquid hardening epoxy adhesive (type that hardens in 15 to 30 minutes is recommended) to temporarily secure the connector at the specified position on the target system. At this time, match the position of pin 1 (position where a corner of the connector is cut into shape C) with the position of pin 1 from the target system. (3) Soldering condition of TC (a) Reflow soldering At 245C for a maximum of 20 seconds (main heating) (b) Manual soldering At 320C for a maximum of 5 seconds (per pin) (4) Precautions on flux splatter If the solder flux splatters when the connector is soldered, faulty contact may occur. Be sure to cover the upper part of the connector with aluminum foil. Do not clean the connector because the flux solvent may remain inside the connector. 2.6.2 Plugging exchange adapter (EA) into TC Figure 2-7. TC Projection
Match the No. 1 pin position of the EA, MA, CA, or SA to the No. 1 pin position of the TC and plug in (C cuts match in both). (a) When plugging or unplugging, hold down the TC with your fingers so that there is no force on the TC. (b) When plugging or unplugging, be careful of the direction of rocking (refer to Figure 2-8). As a tool when unplugging, insert some kind of thin non-conductive material such as a wooden stick in between the TC and EA and rock in the direction shown in Figure 2-8 while slowly unplugging. Be careful since the connector will be damaged if this is done in the wrong direction. Figure 2-8. Plugging and Unplugging
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2.6.3
Notes on handling TC, EA, MA, CA, or SA
(1) Cause of faulty contact of connector (a) If flux gets inside the connector when TC is soldered It is easy for flux to get inside of the connector. Clean the connector several times with a solvent such as alcohol if flux gets inside. If conduction is still unstable, repeat cleaning. (b) If dust gets inside the connector Faulty contact occurs if dust such as a thread gets inside the connector. Remove dust with a brush. (c) Notes on using CA or SA When CA or SA is used, a fractional delay time of signal propagation and a little capacitance are generated as a result of inserting the adapter. Make a thorough evaluation by connecting the target system. (2) Notes on inserting and removing the connector (a) When inserting or removing the connector, be sure to hold down the lower (mating) connector or board with your fingers. (b) Before inserting a connector, make sure that the connectors are correctly positioned. If the connector is inserted incorrectly positioned, it may be damaged. (c) When removing a connector, insert some kind of thin non-conductive material such as a wooden stick beneath the connector to protect the board from being damaged. Do not remove the connector all at once. Remove the connector by jiggling it bit by bit. If only a metallic object such as a screwdriver is available, wind a soft cloth around its tip.
2.7
Mounting and Connecting Connectors (When Using T Type)
This section describes the methods for connecting the QB-V850EIA4 to the target system when using the T Type. Make connections with both the QB-V850EIA4 and target system powered off. The following abbreviations are used in this section. * TC: Target connector * YQ: YQ connector * EA: Exchange adapter * MA: Mount adapter * CA: Check pin adapter * SA: Space adapter 2.7.1 Mounting TC in target system
(1) Thinly apply a two-component epoxy adhesive (hardening time at least 30 minutes) to the ends of the four projections on the base of the TC and adhere the TC to the user board (clean the surface of the user board using alcohol or the like). If alignment of user board pads to TC leads is difficult, align them as in (2). (2) Align by inserting the guide pins for alignment for the TC (NQGUIDE) through the pin holes on the top of the TC. Accessory holes are 1.0 mm non-through holes in two or three places. (For hole positions, see the particular TC drawing.)
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(3) Solder after fitting the MA to the TC. This is to prevent troubles such as flux or solder splatter and adhering to the TC contact pins when soldering. Soldering conditions Solder reflow Manual soldering Caution At 260C for a maximum of 10 seconds At 350C for a maximum of 5 seconds (per pin)
Do not perform cleaning by flux immersion or vapor.
(4) Remove the guide pins. 2.7.2 Connecting YQ on TC (1) After confirming that there are no broken or bent YQ contact pins, fit the YQ in the TC and fasten it using the supplied YQGUIDE (for the fastening method, see the next step, (2)). If repeatedly inserting and removing, be sure to inspect the YQ pins before fitting. If pins are bent, correct them using something thin and flat such as the edge of a knife. (2) Fasten YQ to the TC on the target system using the supplied YQGUIDE. Fasten the screws equally in the four corners using the supplied flat-blade screwdriver or a torque driver. YQGUIDE is 0.054 Nm (MAX.). Too great tightening causes bad connections. Four screws for fitting to the MA (M2 x 10 mm / 4 units) are included with YQ. The tightening torque of
EA
YQGUIDE supplied with YQ YQ
TC
Target system
2.7.3
Inserting EA into YQ
Match the pin 1 position of the YQ or SA (corner cuts match in both) to the pin 1 position of the EA and insert it. * When inserting or removing, press on the TC, YQ, and SA with a finger so that there is no force on the TC. * When inserting or removing, be careful of the direction of wiggling. As a tool when removing, insert some kind of thin non-conductive material such as a wooden stick between the YQ (SA) and EA and wiggle it while slowly removing. Be careful since the connector will be damaged if this is done in the wrong direction.
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2.7.4
Precautions for handling TC, YQ, and SA
(1) When taking the TC from the box, press down on the body and take out the sponge first. (2) Since the pins of the YQ are thin and easily bent, be careful. When inserting it in the TC, confirm that there are no bent pins. (3) When screwing a YQ soldered to a board to the TC, fasten the screws in four places in turn using a #0 or #1 Phillips precision screwdriver or torque driver after tentatively tightening them. Fix the torque at 0.054 Nm (MAX.). If just one place is overtightened, it may cause poor contact. Moreover, a board being connected to the YQ must have accessory holes in prescribed positions (4 places: 2.3 mm or 3.3 mm). The 3.8 mm or 4.3 mm that is the screw head size is an area where wiring is prohibited. (4) In YQ and SA removal, since there is a danger of YQ pins being bent or broken when prying and wiggling, remove them gradually using a flatbladed screwdriver from four directions. Moreover, to connect and use the YQ and SA, screw the YQ to the TC according to the YQGUIDE (included with the YQ) using a 2.3 mm flatbladed screwdriver and then connect it to the SA. Fix the torque at 0.054 Nm (MAX.). If even one place is overtightened, it may cause poor contact.. (5) For the TC, YQ, and SA, since there is a danger that cleaning fluid on the structure will remain in the connector, do not perform cleaning. (6) TC, IC, and YQ cannot be used in combination. (7) An TC/YQ system cannot be used in an environment of vibrations or shocks. (8) It is assumed that this product will be used in system development and evaluation. Moreover, when used in Japan, Electrical Appliance and Material Control Law and electromagnetic disturbance countermeasures have not been applied. (9) Since there are rare cases of shape change if the box is left for a long time in a place where it is 50C or higher, for safekeeping, store it in a place where it is no higher than 40C and direct sunlight does not hit it. (10) For details about handling the TC, YQ, and SA, see the NQPACK series technical materials at the website of Tokyo Eletech Corporation. Tokyo Eletech Corporation website: http://www.tetc.co.jp/ (11) The check pin adapter QB-144-CA-01 is an optional product for IECUBE, and can be used to measure the waveform between IECUBE and the target system. Since the pins on the QB-144-CA-01 do not correspond to the pin layout in each device, the pin header cover must be mounted according to the device to be used. For mounting methods of the pin header cover, refer to [Related Information] on the following webpage. URL: http://www.necel.com/micro/english/iecube/index.html 2.7.5 Precautions for mounting IC using TC and MA
(1) Confirm that there is no weld flash in the resin (sealant part) of the IC. If there is weld flash, remove it using a knife or the like. (2) Confirm that there is no weld flash breaking or bending of IC leads. In particular, confirm the planarity of IC leads. If there is abnormality in the planarity, correct that portion. (3) Viewing the TC contact pins from the top, if there are foreign bodies on them, remove them using a brush or the like. After confirming (1) to (3), fit the IC to the TC. Also fit the MA. (4) Put the supplied M2 x 6 mm screws in the four accessory holes of the MA and fasten the screws in opposite corners. At that time, use either the dedicated screwdriver that is supplied or a torque driver to fasten them equally in turn with a tightening torque of 0.054 Nm (MAX.). Since the contact is poor if tightening is too great, once you have lightly fastened the MA screws, tighten them again.
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(5) Depending on the use environment, when starting up a device that has been left for a long time, starting it may be difficult. In this case, loosen the screws slightly and then retighten them. (6) If startup still is difficult after (5) above, check (1) to (3) again. (7) Tightening the screws of the MA too much may give rise to cracks in the molded part of the MA (plastic part) and bend the mold into a bowed shape, making contact poor. (8) After soldering the TC, do not perform cleaning by flux immersion or vapor.
2.8
2.8.1
Connecting QB-V850EIA4 to Target System
When not using extension probe (QB-144-EP-01S/02S)
The QB-V850EIA4 can be connected to the target system without using an extension probe. Adjust the height by using the spacer at the rear part of the QB-V850EIA4, so that no stress is applied to the exchange adapter, the target connector, and other connectors. Sufficiently insulate the target system. Figure 2-9. Connection Without Extension Probe
QB-V850EIA4
Height adjustable
Exchange adapter Rear spacer
Target connector
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2.8.2
When using extension probe (QB-144-EP-01S/02S)
When using the extension probe (QB-144-EP-01S/02S), connect the QB-V850EIA4 and the target system in the following procedure. (a) Connecting probe holder Use the probe holder (supplied with the QB-V850EIA4) to connect the extension probe to the QB-V850EIA4, as shown below. Figure 2-10. Using Probe Holder
<1> Connect the QB-V850EIA4 and probe.
Extension probe
Probe holder Insert
<2> Insert the probe holder into QB-V850EIA4.
QB-V850EIA4
Insert the probe holder into QB-V850EIA4 until you hear a click (note the direction).
(b) Connection of extension probe GND wire There are 3 GND wires in the extension probe. Connect them to the QB-V850EIA4 and target system. <1> Fasten the GND wire on the QB-V850EIA4 side of the extension probe to the nut on the bottom of the QB-V850EIA4 using a #0 or #1 Phillips precision driver (connection of (B) to (A) in Figure 2-11). <2> Next plug the connector on top of the extension probe into the connector at the opening on the bottom of the QB-V850EIA4 from below being careful of the insertion direction (connection of (C) in Figure 2-11 to QB-V850EIA4).
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Figure 2-11. GND Wire
QB-V850EIA4
Target system
<3> Connect the exchange adapter and extension probe to the target connector. <4> Connect two GND wires on the target system side of the extension probe to the target system GND. If a pin or screw is fastened to the target system GND, remove the transparent terminal cover on the end of the GND wire and fasten the Y type pin of the GND wire to the target system ((G) in Figure 2-11). If the GND on the target system is an exposed pad, likewise fasten the Y type pin to the pad on the target system by soldering ((H) in Figure 2-11) (recommended soldering iron temperature setting: 300C). <5> If the target system has only one GND, connect only one of the GND wires of the extension probe. Cut off the other GND wires with a nipper or leave it as is without removing the pin cover.
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<6> Since the length of the GND wire below the head (insulated part) is approximately 60 mm, there must be at least a GND to which it can be connected to within the range of the three approximately 60 mm radius sections of the target system for connecting the extension probe, as shown in Figure 2-12. The GND wire of the extension probe is soldered to positions J and K in Figure 2-12. To connect it to position L, remove the wire soldered to J or K and then solder it to L. Figure 2-12. Where GND Wire Can Be Connected
Target system
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(c) Ensuring isolation When connecting the target system to the QB-V850EIA4 using an extension probe, adjust the height using the front spacer or rear spacer of the QB-V850EIA4 and ensure isolation from the target system. Figure 2-13. Connection Using Extension Probe
QB-V850EIA4
Extension probe
Exchange adapter Rear spacer (Height adjustable) Target connector Front spacer (Height adjustable)
(d) Cautions related to extension probe The following cautions pertain to using the extension probe. <1> Be careful that stress of the extension probe is not placed on the target connector. Moreover, when removing the extension probe, remove it slowly while holding down on the exchange adapter with a finger so that there is no stress on the target connector. <2> Be sure to connect the GND wire of the extension probe to the QB-V850EIA4 and the target system. If not, the impedance of the cable becomes unstable, resulting in the lowering of signal transmission characteristics or distortion of the output waveform for an input waveform.
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2.9
Connecting USB Interface Cable and AC Adapter
Plug the USB interface cable supplied with the QB-V850EIA4 into the USB connector of the host machine, and plug the other side into the USB connector on the rear of the QB-V850EIA4. Plug the AC adapter supplied with the QB-V850EIA4 into a receptacle and plug the other side into the power supply connector on the rear of the QB-V850EIA4. For QB-V850EIA4 connector positions, see Figure 2-14. By replacing the AC plug, the AC adapter can support the voltage from 100 to 240 V. The AC plug for 100 V is attached when shipped. Replace it with the AC plug for 220 or 240 V (supplied with the QB-V850EIA4) when the AC adapter is used at 220 or 240 V. Figure 2-14. Connector Positions
Power supply connector (Connect AC adapter)
USB connector (Connect USB interface cable)
2.10 Switching Power On and Off
Be sure to switch the power on and off according to the following procedures. * Switching power on <1> QB-V850EIA4 power on <2> Target system power on <3> Debugger startup
Note
* Switching power off <1> Debugger termination <2> Target system power off
Note
<3> QB-V850EIA4 power off
Note In the procedures, <2> is unnecessary if the target system is not connected. Caution If the wrong sequence was used for the operation, the target system or QB-V850EIA4 may fail.
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Table 3-1. Settings at Shipment
Item JP1 Setting Remarks Pins 1 and 2 are shorted (operating frequencies: 6.876 to 8 MHz). Short pins 2 and 3 if using at the operating frequencies of 4.1 to 6.875 MHz. For details, refer to 2.3 Clock Settings. JP2 All pins are left open.
3 2 1
1 3 5
JP3
2 4 6
Do not change this setting.
8 6 4 2
7 5 3 1
Pins 1 and 2, 3 and 4 are shorted, pins 5 and 6, 7 and 8 are left open (oscillator on the parts board is used).
JP4
Pins 2 and 3 are shorted (target device: V850E/IA3 or
3 2 1
MAIN CLOCK
8 9 10 11 12 13 14 7 6 5 4 3 2 1
V850E/IA4). Short 1 and 2 if the target device is the V850ES/IK1. For details, refer to 2.4 Setting for Target Device. An 8 MHz resonator is connected to pins 3 and 12. A 27 pF capacitor is connected to pins 2 and 13, and pins 5 and 10. The frequency can be changed by mounting an oscillator on the parts board of the QB-V850EIA4. For details, refer to 2.3 Clock Settings. Set to OFF at shipment.
Power switch
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CHAPTER 4 NOTES
4.1
Cautions Regarding Differences Between Actual Device And Emulator
When debugging is performed with QB-V850EIA4 connected to the target system, QB-V850EIA4 performs emulation as if the actual device operates in the target system, although operations of the actual device and QBV850EIA4 differ in the following points. Therefore, the user is responsible for using the actual device for the final evaluation before starting mass production and judging its applicability. 4.1.1 Operation after power application to target system
The target device mounted in the target system starts program execution when reset is released after power application. With QB-V850EIA4, however, the program will not be executed until manipulation to start the program downloaded with the debugger is performed. QB-V850EIA4 can download and execute objects even before their initial value information of a variable is ROMized, but the actual device does not operate normally if the objects have not been ROMized. For details on ROMization, refer to CA850 Ver.3.00 Operation User's Manual (U17293E). 4.1.2 Oscillator
QB-V850EIA4 does not support clock input from the oscillator in the target system. The operating cock frequency may therefore vary between when the target device is mounted and when QB-V850EIA4 is connected. 4.1.3 Pin characteristics
Since the connectors, adapters and circuit board are placed between QB-V850EIA4 and the target system, unlike when the target device is mounted in the target system, the electrical characteristics of the pins differ. In particular, note that the A/D converter conversion results can easily be affected. 4.1.4 Notes on flash self programming function
The flash self programming function cannot be emulated. To use this function, make an evaluation by using an onchip debug emulator or the target device. Some devices support the pseudo emulation function, using a debugger. For the usage, refer to ID850QB Ver. 3.40 Operation User's Manual (U18604E). 4.1.5 Notes on DBTRAP instruction
The DBTRAP instruction cannot be used in the user program because it is used for software breaks. 4.1.6 CLKOUT pin in standby mode
The CLKOUT pin outputs the Low level in IDLE and STOP modes. The status before entering the IDLE or STOP mode is held in the actual device. 4.1.7 On-chip debug function
Emulation of the on-chip debug function is not possible. 4.1.8 Current consumption
The current consumed by QB-V850EIA4 differs from that of the actual device. The current consumption of QB-V850EIA4 is equal to or lower than that of the actual device during normal operation, and HALT and IDLE modes, but it becomes higher than that in the actual device in the STOP mode.
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4.2
4.2.1
Notes On Debugging
Notes on Non-map Break Figure 4-1. Break at Fetching Unused Area
If a program is fetched from an area not used by a program (unused area) with an emulator, a non-map break usually occurs. However, a non-map break does not occur in the first 16-byte space of each unused area (refer to Figure 4-1). 4.2.2 PSC Register Access
Used area (Non-map break does not occur) Non-map break does not occur in this area Unused area (Non-map break occurs) 16 bytes Used area (Non-map break does not occur) Unused area (Non-map break occurs) 16 bytes Used area (Non-map break does not occur)
Data is written to the PSC register in the following sequence. If a software break is set to the NOP instruction immediately after the register has been accessed, the debugger hangs up. Example: mov 0x2,r1 st.b r1,prcmd st.b r1,psc nop nop Debugger hangs up if a software break is set here.
There is no problem if a software break is set here or later.
To set a break immediately after the PSC register has been written, use a hardware break. 4.2.3 Notes on DBPC, DBPSW, and ECR Registers
The DBPC, DBPSW, and ECR registers cannot be accessed during a break. If a value is written to any of these registers during a break, the written value is ignored. If these registers are read, 0 is always read. 4.2.4 Notes on Trace Display Sequence
When the trace mode that displays the access history is used, the display sequence may be reversed. * If read and write instructions are successively executed * If a bit manipulation instruction that executes read-modify-write is executed (such as SET, NOT, or CLR) In both the cases, the trace results of write and read are displayed in that order. 4.2.5 Notes on Starting Debugger
When the debugger is started, the following warning or error may occur depending on the setting of the debugger and the status of the target system. This is because the status of the target system is not in accordance with the setting of the debugger. If a warning or error occurs, check the status of the target system or the setting of the debugger. It is recommended that the conversion adapter be connected to the QB-V850EIA4 even when the target system is not connected. If the conversion adapter is not connected, the value of the input port may not be correctly read.
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CHAPTER 4 NOTES
* ID850QB
Error No. Error Message "Target" Field of ID850QB Configuration Window Connect Target System Connection Not Connected Ff606 Check connection with the target and turn on power to the target. Wf607 Check the connection of the conversion adapter. Ff608 Ff609 Disconnect the target. Turn off power to the target and disconnect the target. Exchange Adapter Used Not Used Target System Power ON OFF
Not Connect Connected
* MULTI
Error Message "-tc" of 850eserv Start Option With -tc Without -tc Check the target power on. Or please delete "-tc" option. Check the exchange adapter is connected. Remove the target. Or please add "-tc" option and power on the target. Power off and remove the target. Or please add "-tc" option. Target System Connection Connected Not Connected Exchange Adapter Used Not Used Target System Power ON OFF
4.2.6
Simultaneously Executing Two Instructions When Hardware Break Is Set
If a hardware break is set at the first or the next of two instructions that are executed at the same time, the following phenomena may occur. * Break occurs at a place different from where it has been set. * The set break does not occur. To prevent these phenomena, set a software break. The conditions under which two instructions are simultaneously executed are shown on the following pages.
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[Combination of instructions for the occurrence of the simultaneous execution of two instructions] * Condition where "mov + operation instruction" are executed as one instruction If dst of mov and dst of the operation instruction are the same register, except r0, in combination of "mov src, dst" and one of the following instructions: Format I satsubr/satsub/satadd/mulh or/xor/and subr/sub/add Format II Remark shr/sar/shl/mulh
"mov + operation instruction" are executed as one instruction only when the mov instruction is the first instruction of the above combinations of instructions.
* Condition of parallel execution of instructions <1> Combination of one of the following instructions and br instruction Format I nop/mov/not/sld satsubr/satsub/satadd/mulh or/xor/and/tst subr/sub/add/cmp Format II Format IV mov/satadd/add/cmp shr/sar/shl/mulh sld.b/sst.b/sld.h/sst.h/sld.w/sst.w
<2> Combination of one of the following instructions (instructions that do not update flags) and bcc instruction except br instruction Format I Format II Format IV nop/mov/sld mulh/sxb/sxh/zxb/zxh mov/mulh sld.b/sst.b/sld.h/sst.h/sld.w/sst.w
<3> Combination of one of the following instructions and sld instruction Format I nop/mov/not satsubr/satsub/satadd/mulh or/xor/and/tst subr/sub/add/cmp Format II mov/satadd/add/cmp shr/sar/shl/mulh Remark Of <1> to <3>, two instructions are simultaneously executed only when the second instruction of the above combinations of instructions is br/brcc/sld Caution Formats I, II, and IV are the instruction formats described in the V850E1 Architecture User's Manual (U14559E).
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* Cases in which two instructions are not simultaneously executed In the following cases, two instructions are not simultaneously executed. (a) If the first instruction is the first instruction after execution branches to an address that is not word aligned. Example 0x1006 0x1008 mov r10,r12 sld.b 0x8[ep],r11
If a branch to address 0x1006 occurs, the two instructions are not executed simultaneously because the first instruction is not word aligned (because the lower 1 byte of the address is not 0, 4, 8, A, or C). (b) If the second instruction is sld and writing to the ep register is not completed. Example 0x1004 0x1006 mov r10,ep sld.b 0x8[ep],r11
In this case, the value of r10 is written to the ep register by the mov instruction at address 0x1004. However, the two instructions are not executed simultaneously because WB (writeback) of the mov instruction is not completed when the sld.b instruction at address 0x1006 is executed. (c) If the second instruction is bcc (conditional branch instruction) and a flag hazard occurs (the instruction immediately before or the instruction before that instruction may update the flags). Example 0x1004 0x1006 cmp r0,r10 bn 0xf0
The bn instruction that references the S flag and branches must wait for execution of the cmp instruction at address 0x1004 because the S flag is changed by the cmp instruction. As a consequence, the bn instruction causes a flag hazard and the two instructions are not executed simultaneously. (d) If the second instruction is sld and both of the load buffers are in the WB wait status. Example Suppose that the following instructions are located in the memory. 0x1000 0x1002 nop nop
0x1004 ld.w 0x3000[r10],r11 0x1008 ld.w 0x3004[r10],r12 0x100c mov r8,r9 0x100e sld.b 0x10[ep],r13 If ld.w at addresses 0x1004 and 0x1008 accesses the external memory, several clocks of wait states are inserted. If the instruction at address 0x100e is executed, then the load buffer is in the "WB wait" status because WB of the ld.w instructions at addresses 0x1004 and 0x1008 is not completed, and the two instructions at address 0x100c and 0x100e are not simultaneously executed. 4.2.7 Operation during Break
Since various peripheral functions operate even during breaks in the in-circuit emulator, interrupts due to peripheral functions, generated during breaks, are suspended and, when re-executing after the breaks, execution may occur after processing of suspended interrupts. The watchdog timer counter, however, stops during the breaks. The following peripheral functions can be stopped when using the peripheral break functions. When using the ID850QB, this setting can be made in the Configuration dialog box.
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CHAPTER 4 NOTES
* Timer P * Timer Q * Timer M * Watch timer 4.2.8 RAM. A non-map break occurs if all of the following conditions are satisfied, even if the program itself is correct. * A program is executed in the internal RAM area. * Data access for the internal RAM area is performed twice in succession. * An execution branches to the internal ROM area using a JR or JARL instruction immediately after the above successive data access, or one NOP instruction after the above successive data access. In order not to generate the break, cancel the fail-safe break setting for the internal RAM in the debugger. Click the [Detail] button in the Fail-safe Break field in the Configuration window and clear the check in the check box for "Internal RAM". When an Illegal Break Occurs during Program Execution in Internal RAM
An illegal break may occur when a peripheral I/O register is accessed during program execution in the internal
Cancel the fail-safe break for "ramgrd" and "ramgrdv" using the Target flsf command. 4.2.9 Motor control pins
When motors are controlled with timer pins, the motor control signal is not fed back upon CPU stoppage (break), which may have an adverse effect on the motor. To avoid this, QB-V850EIA4 supports the open break function that is used to set timer pins to the high impedance state upon CPU stoppage. The following pins are subject to the open break function. For details on the open break function settings, refer to ID850QB Ver. 3.40 Operation User's Manual (U18604E). Target pin : TOQ0T1-TOQ0T3, TOQ0B1-TOQ0B3, TOP21, TOQ1T1-TOQ1T3, TOQ1B1-TOQ1B3, TOP31 4.2.10 Conflict between program execution for internal RAM and DMA transfer If the following two operations are executed at the same time, the CPU may deadlock due to an internal bus conflict. * Instruction for accessing data at addresses mis-aligned in the internal RAM * DMA transfer for the internal RAM
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41
CHAPTER 5 OPTIONAL FUNCTIONS
The following functions can be added to the QB-V850EIA4. This chapter explains the functional outline and specifications of the optional functions, and how to obtain them. * Coverage measurement function * TimeMachineTM function The support status of each optional function differs depending on the debugger used. The following table lists the support statuses as of February 2007. If you have any questions regarding the support status, consult an NEC Electronics sales representative or distributor.
Function ID850QB Coverage measurement function TimeMachine function Supported in V2.90, V3.10 and later Not supported Support Status MULTI Support under consideration Supported in 850eserv2 V1.000 and later
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CHAPTER 5 OPTIONAL FUNCTIONS
5.1
Coverage Measurement Function
This section explains the functional outline of the coverage measurement function and differences in specifications that occur after the addition of this function. 5.1.1 Functional outline
The coverage measurement function is used to measure the percentage of the executed code in a load module, section, or other such area. After the addition of this function, the Code Coverage window will be added and the Source and Assemble windows will be modified in the debugger ID850QB, as follows. * Code Coverage window
Displays the coverage (%) of the executed code for total code in a load module.
Displays the coverage (%) of the executed code * Source window and Assemble window separately by functions, sections and vectors.
The executed lines are highlighted.
Refer to the user's manual for the debugger for details on use of the coverage measurement function. 5.1.2 Differences from hardware specifications
After addition of the coverage measurement function, differences from the hardware specifications described in this manual are as follows. * External dimensions The height increases by 9 mm.
68 mm
77 mmNote
Note When the rear spacer is adjusted to the lowest height (107 mm max.) * Weight The weight increases by approximately 70 g.
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43
CHAPTER 5 OPTIONAL FUNCTIONS
5.2
TimeMachine Function
This function is supported by the Green Hills Software (GHS) debugger. For details on the functional outline and specifications, consult a GHS tool distributor.
5.3
Changes to Top Side of Product Consequent to Addition of Optional Functions
After the addition of the optional functions, the following stickers will be attached to the top of the QB-V850EIA4. The addition of the optional functions can be confirmed through the presence of these stickers.
A sticker is attached to this position according to the function added, as follows.
For the coverage measuring function:
For the TimeMachine function:
QB-V850EIA4 Top View
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CHAPTER 5 OPTIONAL FUNCTIONS
5.4
How to Add Optional Functions
To add the optional functions, the option board corresponding to each function, as listed in the following, must be mounted.
Function Coverage measurement function TimeMachine function Option Board Required for Adding Function Coverage memory board SuperTrace
TM Note 1
Probe board
Notes 1, 2
Notes 1. Either the coverage memory board or the SuperTrace Probe board can be added, but not both. 2. To use the TimeMachine function, the SuperTrace Probe (Green Hills Software (GHS)) must be mounted in the QB-V850EIA4, in addition to the SuperTrace Probe board. For details on specifications and purchases, consult a GHS tool distributor. The following two methods have been provided for mounting the option boards. For more information on ordering, price and schedule, consult an NEC Electronics sales representative or distributor. * New purchase By adding one of the following suffixes at the end of the ordering code, you can purchase the QB-V850EIA4 with the corresponding option board mounted. -C: -S: Coverage memory board mounted SuperTrace Probe board mounted
Part number examples: QB-V850EIA4-ZZZ-S * System upgrade Using this method, the option board can be mounted in your QB-V850EIA4.
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45
APPENDIX A REVISION HISTORY
A.1 Major Revisions in This Edition
Page CHAPTER 1 GENERAL p.13 p.14 p.15 Addition of Figure 1-2. System Configuration (T Type) Addition of Table 1-4. List of Probe/Connector for Each Target Device (T Type) Change of 1.4 Package Contents Description
CHAPTER 2 SETUP PROCEDURE p.26 Addition of 2.7 Mounting and Connecting Connectors (When Using T Type)
A.2 Revision History of Preceding Editions
Here is the revision history of the preceding editions. Chapter indicates the chapter of each edition.
Edition 2nd edition Major Revision from Previous Edition Table 1-3 List of Probe/Connector for Each Target Device Change of mount adapter from QB-100GF-MA-01S to QB-100GF-MA-02S Figure B-13 Mount Adapter for V850E/IA4 (100-Pin GF Package) (QB-100GFMA-02S) Change of part number of mount adapter 3rd edition Addition of QB-144-EP-02S as extension probe (flexible type) Change of Figure 1-1. External Dimensions Change of Table 1-2. QB-V850EIA4 System Specifications Change of 1.3 System Configuration Change of 2.3.1 Overview of clock settings Change of 2.3.2 Clock setting methods Addition of 4.1 Cautions Regarding Differences Between Actual Device And Emulator Addition of 4.2 Notes On Debugging Addition of chapter CHAPTER 5 OPTIONAL FUNCTIONS Deletion of chapter CHAPTER 5 NOTES ON TARGET SYSTEM DESIGN in second edition Deletion of chapter APPENDIX A CHARACTERISTICS OF TARGET INTERFACE in second edition Deletion of chapter APPENDIX B CHARACTERISTICS OF TARGET INTERFACE in second edition CHAPTER 2 SETUP PROCEDURE CHAPTER 4 NOTES Throughout CHAPTER 1 GENERAL APPENDIX B PACKAGE DRAWINGS Applied to: CHAPTER 1 GENERAL
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For further information, please contact:
NEC Electronics Corporation 1753, Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa 211-8668, Japan Tel: 044-435-5111 http://www.necel.com/ [America] NEC Electronics America, Inc. 2880 Scott Blvd. Santa Clara, CA 95050-2554, U.S.A. Tel: 408-588-6000 800-366-9782 http://www.am.necel.com/ [Europe] NEC Electronics (Europe) GmbH Arcadiastrasse 10 40472 Dusseldorf, Germany Tel: 0211-65030 http://www.eu.necel.com/ Hanover Office Podbielskistrasse 166 B 30177 Hannover Tel: 0 511 33 40 2-0 Munich Office Werner-Eckert-Strasse 9 81829 Munchen Tel: 0 89 92 10 03-0 Stuttgart Office Industriestrasse 3 70565 Stuttgart Tel: 0 711 99 01 0-0 United Kingdom Branch Cygnus House, Sunrise Parkway Linford Wood, Milton Keynes MK14 6NP, U.K. Tel: 01908-691-133 Succursale Francaise 9, rue Paul Dautier, B.P. 52 78142 Velizy-Villacoublay Cedex France Tel: 01-3067-5800 Sucursal en Espana Juan Esplandiu, 15 28007 Madrid, Spain Tel: 091-504-2787 Tyskland Filial Taby Centrum Entrance S (7th floor) 18322 Taby, Sweden Tel: 08 638 72 00 Filiale Italiana Via Fabio Filzi, 25/A 20124 Milano, Italy Tel: 02-667541 Branch The Netherlands Steijgerweg 6 5616 HS Eindhoven The Netherlands Tel: 040 265 40 10
G0706
[Asia & Oceania] NEC Electronics (China) Co., Ltd 7th Floor, Quantum Plaza, No. 27 ZhiChunLu Haidian District, Beijing 100083, P.R.China Tel: 010-8235-1155 http://www.cn.necel.com/ Shanghai Branch Room 2509-2510, Bank of China Tower, 200 Yincheng Road Central, Pudong New Area, Shanghai, P.R.China P.C:200120 Tel:021-5888-5400 http://www.cn.necel.com/ Shenzhen Branch Unit 01, 39/F, Excellence Times Square Building, No. 4068 Yi Tian Road, Futian District, Shenzhen, P.R.China P.C:518048 Tel:0755-8282-9800 http://www.cn.necel.com/ NEC Electronics Hong Kong Ltd. Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: 2886-9318 http://www.hk.necel.com/ NEC Electronics Taiwan Ltd. 7F, No. 363 Fu Shing North Road Taipei, Taiwan, R. O. C. Tel: 02-8175-9600 http://www.tw.necel.com/ NEC Electronics Singapore Pte. Ltd. 238A Thomson Road, #12-08 Novena Square, Singapore 307684 Tel: 6253-8311 http://www.sg.necel.com/ NEC Electronics Korea Ltd. 11F., Samik Lavied'or Bldg., 720-2, Yeoksam-Dong, Kangnam-Ku, Seoul, 135-080, Korea Tel: 02-558-3737 http://www.kr.necel.com/


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